IP Library Assignment 017900/0625
Patent Assignment
Reel/Frame 017900/0625

Assignment of Assignor's Interest

Recorded: 2006-05-16 Pages: 3
Assignors
KOMIYAMA, JUN
Executed: 2006-02-07
ABE, YOSHIHISA
Executed: 2006-02-07
SUZUKI, SHUNICHI
Executed: 2006-02-07
NAKANISHI, HIDEO
Executed: 2006-02-07
Assignee
TOSHIBA CERAMICS CO., LTD.
6-3, OHSAKI 1-CHOME, SHINAGAWA-KU, TOKYO, 141-0032, JAPAN
Covered Property (1)
Substrate for compound semiconductor device and compound semiconductor device using the same
Application: 11/434,115 →
Publication: US 2007/0069216
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Jul 5, 2007
From: TOSHIBA CERAMICS CO., LTD.
To: COVALENT MATERIALS CORPORATION
Reel/Frame 019511/0735 →