IP Library Assignment 019511/0735
Patent Assignment
Reel/Frame 019511/0735

Merger

Recorded: 2007-07-05 Pages: 13
Assignor
TOSHIBA CERAMICS CO., LTD.
Executed: 2007-06-01
Assignee
COVALENT MATERIALS CORPORATION
6-3, OHSAKI 1-CHOME, SHINAGAWA-KU, TOKYO, JAPAN
Covered Properties (18)
Reflection Plate for Semiconductor Heat Treatment and Manufacturing Method Thereof
Patent: 7,336,892 →
Application: 10/391,583 →
Publication: US 2003/0184696
Member for regenerating joint cartilage and process for producing the same, method of regenerating joint cartilage and artificial cartilage for transplantation
Application: 10/513,695 →
Publication: US 2005/0159820
Acicular Silicon Crystal and Process for Producing the Same
Patent: 7,396,409 →
Application: 10/526,486 →
Publication: US 2005/0244324
Semiconductor Wafer Treatment Member
Patent: 7,255,775 →
Application: 10/603,781 →
Publication: US 2004/0089236
Silicon Wafer Cleaning Method
Patent: 7,226,513 →
Application: 10/645,911 →
Publication: US 2004/0045580
Substrate for Growing Electro-Optical Single Crystal Thin Film and Method of Manufacturing the Same
Patent: 7,262,485 →
Application: 11/174,610 →
Publication: US 2006/0011941
Method for manufacturing synthetic silica glass substrate for photomask and synthetic silica glass substrate for photomask manufactured thereby
Application: 11/248,185 →
Publication: US 2006/0081008
Compound Semiconductor and Compound Semiconductor Device Using the Same
Patent: 7,368,757 →
Application: 11/298,490 →
Publication: US 2006/0138448
Silicon member and method of manufacturing the same
Application: 11/339,564 →
Publication: US 2006/0170078
Substrate for compound semiconductor device and compound semiconductor device using the same
Application: 11/434,115 →
Publication: US 2007/0069216
Method of Manufacturing Silicon Wafer
Patent: 7,374,955 →
Application: 11/518,514 →
Publication: US 2007/0059904
Method of manufacturing silicon wafer
Application: 11/526,868 →
Publication: US 2007/0068447
Culture Substrate and Culture Method for Undifferentiated Cell and Undifferentiated Cultured Cell
Patent: 9,096,826 →
Application: 11/561,055 →
Publication: US 2007/0117204
Hydrophilicity Treatment Method of a Silicon Wafer
Patent: 7,514,364 →
Application: 11/709,739 →
Publication: US 2007/0207615
Nitride semiconductor single crystal film
Application: 11/714,259 →
Publication: US 2007/0210304
Silica Glass Crucible
Patent: 7,909,931 →
Application: 11/729,862 →
Publication: US 2007/0256628
Porous body and producing method thereof
Application: 11/730,705 →
Publication: US 2007/0231884
Method of manufacturing semiconductor device, method of manufacturing semiconductor substrate and semiconductor substrate
Application: 11/798,808 →
Publication: US 2007/0269984
Related Assignments (24)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 20, 2003
From: SHIMANUKI, KAZUHIKO; HONMA, HIROYUKI; SAITO, NORIHIKO; YOKOYAMA, HIDEYUKI
To: TOSHIBA CERAMICS CO., LTD.; TOKYO ELECTRON LIMITED
Reel/Frame 013898/0646 →
Assignment of Assignor's Interest Jun 26, 2003
From: YOKOGAWA, MASANARI; HAGIHARA, HIROTAKA; WAGATSUMA, SHINYA; KITAYAMA, KOUTAROU
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 014254/0780 →
Assignment of Assignor's Interest Aug 22, 2003
From: KURITA, HISATSUGU; HIRASAWA, MANABU; NAGAHAMA, HIROMI; IZUMOME, KOJI
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 014424/0822 →
Assignment of Assignor's Interest Nov 8, 2004
From: YOSHIKAWA, HIDEKI; MYOI, AKIRA; TAMAI, NORIYUKI
To: TOSHIBA CERAMICS CO., LTD.; MMT. CO., LTD.; YOSHIKAWA, HIDEKI
Reel/Frame 016414/0324 →
Assignment of Assignor's Interest Mar 4, 2005
From: HATTA, AKITMITSU; YOSHIMURA, HIROAKI; ISHIMOTO, KEIICHI; KANAKUSA, HIROAKI
To: TOSHIBA CERAMICS CO., LTD.; TECHNO NETWORK SHIKOKU CO., LTD.
Reel/Frame 016806/0844 →
Assignment of Assignor's Interest Jul 6, 2005
From: ABE, YOSHIHISA; SUZUKI, SHUNICHI; NAKANISHI, HIDEO; KOMIYAMA, JUN
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 016762/0081 →
Assignment of Assignor's Interest Oct 13, 2005
From: HIRATA, HIROYASU; FUKASAWA, YUJL; EZAKI, MASANOBU
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 017092/0480 →
Assignment of Assignor's Interest Dec 12, 2005
From: KOMIYAMA, JUN; ABE, YOSHIHISA; SUZUKI, SHUNICHI; NAKANISHI, HIDEO
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 017356/0641 →
Assignment of Assignor's Interest Jan 26, 2006
From: MORIYA, MASATAKA; KASHIMA, KAZUHIKO; MIYANO, SHINICHI
To: TOSHIBA CERAMICS CO., LTD.; TOKYO ELECTRON LIMITED
Reel/Frame 017505/0913 →
Assignment of Assignor's Interest May 16, 2006
From: KOMIYAMA, JUN; ABE, YOSHIHISA; SUZUKI, SHUNICHI; NAKANISHI, HIDEO
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 017900/0625 →
Assignment of Assignor's Interest Oct 11, 2006
From: IZUNOME, KOJI
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 018374/0050 →
Assignment of Assignor's Interest Oct 27, 2006
From: IZUNOME, KOJI; HIRANO, YUMIKO; WATANABE, TAKASHI; KASHIMA, KAZUHIKO
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 018445/0790 →
Assignment of Assignor's Interest Jan 30, 2007
From: KITAGAWA, FUMIHIKO; IMAIZUMI, TAKAFUMI; SASAKI, KATSUNORI
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 018820/0819 →
Assignment of Assignor's Interest Feb 23, 2007
From: SAKAMOTO, TAKAO
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 019053/0272 →
Assignment of Assignor's Interest Mar 6, 2007
From: KOMIYAMA, JUN; ABE, YOSHIHISA; SUZUKI, SHUICHI; NAKANISHI, HIDEO
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 019074/0581 →
Assignment of Assignor's Interest Mar 30, 2007
From: SAITO, RYOUHEI; KIKUCHI, TOSHIYUKI; MISU, KIYOAKI; FUKUTANI, KAZUKO
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 019185/0069 →
Assignment of Assignor's Interest Apr 3, 2007
From: KITAGAWA, FUMIHIKO; IMAIZUMI, TAKAFUMI
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 019174/0913 →
Assignment of Assignor's Interest May 17, 2007
From: ARAKI, NOBUE
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 019392/0439 →
Assignment of Assignor's Interest Mar 11, 2013
From: COVALENT MATERIALS CORPORATION
To: COVALENT SILICON CORPORATION
Reel/Frame 029962/0497 →
Change of Name Mar 13, 2013
From: COVALENT SILICON CORPORATION
To: GLOBALWAFERS JAPAN CO., LTD.
Reel/Frame 029991/0421 →
Change of Name Nov 5, 2015
From: COVALENT MATERIALS CORPORATION
To: COORSTEK KK
Reel/Frame 037054/0757 →
Change of Name & Address Apr 11, 2016
From: COVALENT MATERIALS CORPORATION
To: COORSTEK KK
Reel/Frame 038399/0880 →
Assignment of Assignor's Interest Oct 13, 2023
From: COORSTEK KK
To: MOMENTIVE TECHNOLOGIES YAMAGATA KK
Reel/Frame 065211/0451 →
Change of Name May 2, 2024
From: COORSTEK KK
To: COORSTEK GK
Reel/Frame 067565/0354 →