Method of manufacturing semiconductor device, method of manufacturing semiconductor substrate and semiconductor substrate
A method of manufacturing a semiconductor device and a semiconductor substrate including: a step of subjecting the semiconductor substrate to a wet process by relatively moving a process liquid and the semiconductor substrate during the wet process in an environment where there is not a static electricity removing effect with respect to the semiconductor substrate, the semiconductor substrate having a single crystal, polycrystalline, or amorphous silicon on at least a part of its surface; and a step of holding the semiconductor substrate with a jig electrified to the same extent as that of the semiconductor substrate after the wet process or a non-conductive jig. And a semiconductor substrate which is electrified to +100 V to +12 kV.
1 . A method of manufacturing a semiconductor device comprising:
a step of subjecting a semiconductor substrate to a wet process by relatively moving a process liquid and said semiconductor substrate during the wet process in an environment where there is not a static electricity removing effect with respect to said semiconductor substrate, said semiconductor substrate having a single crystal, polycrystalline, or amorphous silicon on at least a part of its surface; and
a step of holding said semiconductor substrate with a jig electrified to the same extent as that of said semiconductor substrate after said wet process or a non-conductive jig.
2 . The method of manufacturing the semiconductor device according to claim 1 , wherein said process liquid is a hydrogen fluoride acid aqueous solution.
3 . The method of manufacturing the semiconductor device according to claim 1 , wherein said non-conductive jig is made of polypropylene (PP).
4 . The method of manufacturing the semiconductor device according to claim 1 , wherein a dummy substrate with the same potential as that of said semiconductor substrate is held to be adjacent to said semiconductor substrate in the step of holding said semiconductor substrate with the non-conductive jig.
5 . The method of manufacturing the semiconductor device according to claim 3 , wherein a dummy substrate with the same potential as that of said semiconductor substrate is held to be adjacent to said semiconductor substrate in the step of holding said semiconductor substrate with the non-conductive jig.
6 . A method of manufacturing a semiconductor substrate comprising:
a step of subjecting said semiconductor substrate to a wet process by relatively moving a process liquid and said semiconductor substrate during the wet process in an environment where there is not a static electricity removing effect with respect to said semiconductor substrate, said semiconductor substrate having a single crystal, polycrystalline, or amorphous silicon layer on at least its surface; and
a step of holding said semiconductor substrate with a jig electrified to the same extent as that of said semiconductor substrate after said wet process or a non-conductive jig.
7 . A semiconductor substrate having a single crystal, polycrystalline, or amorphous silicon layer on at least its surface, and being electrified to +100 V to +12 kV.
8 . The method of manufacturing the semiconductor device according to claim 2 , wherein said non-conductive jig is made of polypropylene (PP).
9 . The method of manufacturing the semiconductor device according to claim 2 , wherein a dummy substrate with the same potential as that of said semiconductor substrate is held to be adjacent to said semiconductor substrate in the step of holding said semiconductor substrate with the non-conductive jig.