Assignment of Assignor's Interest

Recorded: 2007-05-17 Pages: 3

Assignor

ARAKI, NOBUE

Executed: 2007-05-08

Assignee

TOSHIBA CERAMICS CO., LTD.

6-3, OHSAKI 1-CHOME, SHINAGAWA-KU, TOKYO, 141-0032, JAPAN

Covered Property (1)

Method of manufacturing semiconductor device, method of manufacturing semiconductor substrate and semiconductor substrate

Application: 11/798,808 →

Publication: US 2007/0269984

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.