Patent Assignment
Reel/Frame 067565/0354
Change of Name
Recorded: 2024-05-02
Pages: 6
Assignor
COORSTEK KK
Executed: 2024-01-01
Assignee
COORSTEK GK
11-1, OSAKI 2-CHOME, SHINAGAWA-KU, TOKYO, 1410032, JAPAN
Covered Properties
(41)
Susceptor
Culture Substrate and Culture Method for Undifferentiated Cell and Undifferentiated Cultured Cell
Transparent Rare-Earth Oxide Sintered Body and Manufacturing Method Thereof
Carrier for Undifferentiated Cell Culture and Subculture Method Thereof
Micro Channel Structure Body and Method of Manufacturing Micro Channel Structure Body
Decompression Apparatus and Inorganic Porous Body
Process for Producing Ceramic Fine Particles, and Ceramic Fine Particle Producing Apparatus Used Therein
Compound Semiconductor Substrate Comprising a Multilayer Buffer Layer
Ceramics composite
Cell Culture Support and Cell Culture Method
Nitride Semiconductor Substrate and Method of Manufacturing the Same
Nitride Semiconductor Substrate
Ceramics Composite
Heat-Insulating Material
Method of Analyzing Nitride Semiconductor Layer and Method of Manufacturing Nitride Semiconductor Substrate Using the Analysis Method
Nitride Semiconductor Substrate
Nitride Semiconductor Substrate
Focus ring for plasma processing apparatus
Wavelength Converting Member
HEAT INSULATING MATERIAL CONTAINING A POROUS SINTERED BODY FORMED OF MgAl2O4
Heat Insulator
Nitride Semiconductor Substrate
Wafer Boat and Manufacturing Method of the Same
Nitride Semiconductor Substrate Having Recesses at Interface Between Base Substrate and Initial Nitride
Compound Semiconductor Substrate
Particles for Monolithic Refractory
Composite Silica Glass Made Light Diffusion Member
Planar Heater
Silica Glass Member and Method of Manufacturing the Same
Ceramic Composite, Phosphor for Projector Including the Same, and Light Emitting Device for Projector Including the Same
Vertical Wafer Boat
Patent:
10,008,402 →
Application:
15/897,006 →
Nitride Semiconductor Substrate and Method for Manufacturing the Same
Short Carbon Fiber-Reinforced Composite Material and Method for Producing Same
Nitride Semiconductor Epitaxial Substrate
Glass Member
Break Filter Using a Silicon Carbide Porous Body and Manufacturing Method of the Break Filter
Nitride Semiconductor Substrate
Conductive Diffuser and Manufacturing Method of the Same
Nitride Semiconductor Substrate
Nitride Semiconductor Substrate and Method of Manufacturing the Same
Phosphor Plate
Related Assignments
(22)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 22, 2005
From: YOKOGAWA, MASANARI
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 017024/0291 →
Assignment of Assignor's Interest
Oct 31, 2006
From: FUJITA, MITSUHIRO; IRIE, MASAKI
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 018484/0160 →
Assignment of Assignor's Interest
Jan 30, 2007
From: KITAGAWA, FUMIHIKO; IMAIZUMI, TAKAFUMI; SASAKI, KATSUNORI
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 018820/0819 →
Merger
Jul 5, 2007
From: TOSHIBA CERAMICS CO., LTD.
To: COVALENT MATERIALS CORPORATION
Reel/Frame 019511/0735 →
Merger
Sep 12, 2007
From: TOSHIBA CERAMICS CO., LTD.
To: COVALENT MATERIALS CORPORATION
Reel/Frame 019805/0793 →
Assignment of Assignor's Interest
Jan 30, 2008
From: KITAGAWA, FUMIHIKO; IMAIZUMI, TAKAFUMI; SASAKI, KATSUNORI
To: COVALENT MATERIALS CORPORATION
Reel/Frame 020437/0902 →
Assignment of Assignor's Interest
Oct 13, 2008
From: GOTO, HIROYUKI; MURAYAMA, HARUO; KIMIJIMA, SUSUMU; ICHISHIMA, MASAHIKO
To: COVALENT MATERIALS CORPORATION
Reel/Frame 021674/0208 →
Assignment of Assignor's Interest
Oct 16, 2008
From: SAITO, NORIHIKO; TAKEDA, SOTARO
To: COVALENT MATERIALS CORPORATION
Reel/Frame 021692/0496 →
Assignment of Assignor's Interest
Feb 20, 2009
From: GOTO, HIROYUKI; UEMOTO, HIDEO; SUGINO, TOMOKI
To: COVALENT MATERIALS CORPORATION
Reel/Frame 022292/0156 →
Assignment of Assignor's Interest
Sep 10, 2010
From: KOMIYAMA, JUN; ERIGUCHI, KENICHI; OISHI, HIROSHI; ABE, YOSHIHISA
To: COVALENT MATERIALS CORPORATION
Reel/Frame 024966/0259 →
Assignment of Assignor's Interest
Aug 10, 2011
From: IRIE, MASAKI; FUJITA, MITSUHIRO
To: COVALENT MATERIALS CORPORATION
Reel/Frame 026782/0102 →
Assignment of Assignor's Interest
Sep 28, 2011
From: KITAGAWA, FUMIHIKO; IMAIZUMI, TAKAFUMI; TAKEI, SHUNSUKE; YAMAMOTO, ITSUKI
To: COVALENT MATERIALS CORPORATION
Reel/Frame 026985/0720 →
Assignment of Assignor's Interest
Jan 18, 2012
From: YOSHIDA, AKIRA; KOMIYAMA, JUN; ABE, YOSHIHISA; OISHI, HIROSHI
To: COVALENT MATERIALS CORPORATION
Reel/Frame 027554/0262 →
Assignment of Assignor's Interest
Jan 4, 2013
From: ABE, YOSHIHISA; KOMIYAMA, JUN; OISHI, HIROSHI; YOSHIDA, AKIRA
To: COVALENT MATERIALS CORPORATION
Reel/Frame 029568/0325 →
Assignment of Assignor's Interest
Feb 8, 2013
From: IRIE, MASAKI
To: COVALENT MATERIALS CORPORATION
Reel/Frame 029927/0141 →
Assignment of Assignor's Interest
Aug 21, 2013
From: AKAMINE, SHUKO; FUJITA, MITSUHIRO
To: COVALENT MATERIALS CORPORATION
Reel/Frame 031050/0937 →
Assignment of Assignor's Interest
Aug 26, 2013
From: YANASE, YOSHIHATA; SHIRAI, HIROSHI; KOMIYAMA, JUN; OISHI, HIROSHI
To: COVALENT MATERIALS CORPORATION
Reel/Frame 031077/0946 →
Assignment of Assignor's Interest
Apr 22, 2014
From: KOMIYAMA, JUN; ERIGUCHI, KENICHI; YOSHIDA, AKIRA; OISHI, HIROSHI
To: COVALENT MATERIALS CORPORATION
Reel/Frame 032725/0572 →
Assignment of Assignor's Interest
May 7, 2014
From: KOMIYAMA, JUN; YOSHIDA, AKIRA; OISHI, HIROSHI
To: COVALENT MATERIALS CORPORATION
Reel/Frame 032837/0400 →
Change of Name
Nov 5, 2015
From: COVALENT MATERIALS CORPORATION
To: COORSTEK KK
Reel/Frame 037054/0757 →
Change of Name
Apr 4, 2016
From: COVALENT MATERIALS CORPORATION
To: COORSTEK KK
Reel/Frame 038477/0610 →
Change of Name & Address
Apr 11, 2016
From: COVALENT MATERIALS CORPORATION
To: COORSTEK KK
Reel/Frame 038399/0880 →