IP Library Granted Patent US 10,026,633
Granted Patent B2
US 10,026,633 · App. 15/183,004 · Granted Jul 17, 2018

Wafer boat and manufacturing method of the same

Inventor: Takeshi Ogitsu (Yamagata, JP)
Assignee: COORSTEK KK
H01L21/67306B24C1/06C23C16/325C23C16/4404C23C16/4581
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Quick Facts
Patent No.
US 10,026,633
App. No.
15/183,004
Granted
Jul 17, 2018
Kind
B2
Abstract

A wafer boat supporting a silicon wafer to be processed provides a sufficient anchor effect between a deposit film and a SiC coating film formed on a base material, and suppresses generation of particles due to peeling off of the deposit film. The vertical wafer boat includes a plurality of columns, being made of SiC-based material having a SiC coating film on a surface thereof, which contains shelf plate portions for supporting wafers, and a top plate and a bottom plate for fixing upper and lower ends of the columns, wherein a supporting plane which is in contact with an outer peripheral portion of the wafer is provided on an upper surface of the shelf plate portion, and a surface roughness Ra of a lower surface of the shelf plate increases toward a front side of the shelf plate portion from a rear side.

Claims (11)

1. A vertical wafer boat comprising a plurality of columns which is made of SiC-based material with a surface thereof provided with a SiC coating film and includes shelf plate portions for supporting wafers thereon, and a top plate and a bottom plate for fixing upper and lower ends of the columns, wherein

the shelf plate portion has an upper surface provided with a supporting plane which is in contact with an outer peripheral portion of the wafer, and

the shelf plate portion has a lower surface whose surface roughness Ra increases from a rear side toward a front side of the shelf plate portion.

2. The vertical wafer boat according to claim 1 , wherein the surface roughness Ra of the lower surface of the shelf plate portion is in a range of 1.0 μm or more to 3.0 μm or less.

3. The vertical wafer boat according to claim 2 , wherein the top plate and the bottom plate are made of SiC-based material and a SiC coating film is formed on a surface thereof.

4. The vertical wafer boat according to claim 1 , wherein the top plate and the bottom plate are made of SiC-based material and a SiC coating film is formed on a surface thereof.

5. A manufacturing method of a vertical wafer boat including a plurality of columns, which is formed of SiC-based material with a surface thereof provided with a SiC coating film and include shelf plate portions for supporting wafers placed thereon, and a top plate and a bottom plate for fixing upper and lower ends of the columns, the method comprising

a step of performing a process such that a surface roughness Ra of a lower surface of the shelf plate portion increases toward a front side of the shelf plate portion from a rear side.

6. The manufacturing method of a vertical wafer boat according to claim 5 , wherein in the step of performing a roughening process to the lower surface of the shelf plate portion, the roughening process is performed so that the surface roughness Ra is in the range from 1.0 □m or more to 3.0 □m or less.

7. The manufacturing method of a vertical wafer boat according to claim 6 , further comprising a step of performing a smoothing process to an upper surface of the shelf plate portion.

8. The manufacturing method of a vertical wafer boat according to claim 5 , further comprising a step of performing a smoothing process to an upper surface of the shelf plate portion.

Assignments (2)
CHANGE OF NAME Recorded May 2, 2024
From: COORSTEK KK
To: COORSTEK GK
Reel/Frame 067565/0354 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 15, 2016
From: OGITSU, TAKESHI
To: COORSTEK KK
Reel/Frame 038919/0342 →
Priority Claims (1)
JP 2015-129432 · Jun 29, 2015 · national
Continuity (1)
Related Publication 20160379859A1 · Dec 29, 2016
Cited By (1)
US 12,308,266