IP Library Assignment 038399/0880
Patent Assignment
Reel/Frame 038399/0880

Change of Name & Address

Recorded: 2016-04-11 Pages: 40
Assignor
COVALENT MATERIALS CORPORATION
Executed: 2015-10-01
Assignee
COORSTEK KK
11-1, OSAKI 2-CHOME, SHINAGAWA-KU, TOKYO, JAPAN
Covered Properties (28)
Treatment Apparatus for High-Precision Analysis of Impurities in Silicic Material
Patent: 5,849,597 →
Application: 08/769,128 →
A Sic Member and a Method of Fabricating the Same
Patent: 5,937,316 →
Application: 08/879,702 →
Vertical Wafer Boat
Patent: 6,110,285 →
Application: 09/060,293 →
Jig for Semiconductor Wafers and Method for Producing the Same
Patent: 6,093,644 →
Application: 09/104,539 →
Gas Filter Module Having Two-Part Filter and Method of Producing the Same
Patent: 6,210,458 →
Application: 09/220,348 →
Heater
Patent: 6,407,371 →
Application: 09/451,868 →
Fluid Heating Apparatus
Patent: 6,516,143 →
Application: 09/819,702 →
Publication: US 2002/0023919
Heater Sealed with Carbon Wire Heating Element
Patent: 6,584,279 →
Application: 09/864,196 →
Publication: US 2002/0001460
Plasma-Resistant Member for Semiconductor Manufacturing Apparatus and Method for Manufacturing the Same
Patent: 6,838,405 →
Application: 10/208,871 →
Publication: US 2003/0034130
Carbon Wire Heating Object Sealing Heater and Fluid Heating Apparatus Using the Same Heater
Patent: 6,885,814 →
Application: 10/395,395 →
Publication: US 2003/0180034
Semiconductor Wafer and Its Manufacturing Method
Patent: 6,936,490 →
Application: 10/432,597 →
Publication: US 2004/0053438
Semiconductor Wafer Treatment Member
Patent: 7,255,775 →
Application: 10/603,781 →
Publication: US 2004/0089236
Carbon Wire Heating Object Sealing Heater and Fluid Heating Apparatus Using the Same Heater
Patent: 7,072,578 →
Application: 11/038,283 →
Publication: US 2005/0133494
Susceptor
Patent: 7,393,418 →
Application: 11/231,938 →
Publication: US 2006/0065196
Compound Semiconductor and Compound Semiconductor Device Using the Same
Patent: 7,368,757 →
Application: 11/298,490 →
Publication: US 2006/0138448
Transparent Rare-Earth Oxide Sintered Body and Manufacturing Method Thereof
Patent: 7,608,553 →
Application: 11/589,795 →
Publication: US 2007/0105708
Silica Glass Crucible
Patent: 7,909,931 →
Application: 11/729,862 →
Publication: US 2007/0256628
Micro Channel Structure Body and Method of Manufacturing Micro Channel Structure Body
Patent: 8,691,367 →
Application: 12/173,926 →
Publication: US 2009/0029115
Decompression Apparatus and Inorganic Porous Body
Patent: 8,186,380 →
Application: 12/177,630 →
Publication: US 2009/0032127
Plane Heater
Patent: 8,143,557 →
Application: 12/279,953 →
Publication: US 2010/0224620
Process for Producing Ceramic Fine Particles, and Ceramic Fine Particle Producing Apparatus Used Therein
Patent: 8,206,623 →
Application: 12/438,249 →
Publication: US 2010/0219544
Compound semiconductor substrate having multiple buffer layers
Patent: 8,148,753 →
Application: 12/659,927 →
Publication: US 2010/0244100
Compound Semiconductor Substrate Comprising a Multilayer Buffer Layer
Patent: 8,212,288 →
Application: 12/879,035 →
Publication: US 2011/0062556
Ceramics composite
Patent: 8,940,390 →
Application: 13/137,389 →
Publication: US 2012/0045634
Cell Culture Support and Cell Culture Method
Patent: 8,673,638 →
Application: 13/204,324 →
Publication: US 2012/0034694
Nitride Semiconductor Substrate and Method of Manufacturing the Same
Patent: 8,785,942 →
Application: 13/352,987 →
Publication: US 2012/0211763
Nitride Semiconductor Substrate
Patent: 8,637,960 →
Application: 13/633,473 →
Publication: US 2013/0082355
Ceramics Composite
Patent: 9,045,691 →
Application: 13/762,320 →
Publication: US 2013/0256599
Related Assignments (23)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 18, 1996
From: TOKUOKA, FUMIO; SHIMANUKI, KAZUHIKO
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 008355/0772 →
Assignment of Assignor's Interest Jun 20, 1997
From: INABA, TAKESHI; TAKEDA, SYUICHI; SATO, MASANORI
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 008646/0448 →
Assignment of Assignor's Interest Apr 15, 1998
From: KITAZAWA, ATSUO; HOMMA, HIROYUKI; TAKEDA, SHUICHI
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 009098/0694 →
Assignment of Assignor's Interest Jun 26, 1998
From: INABA, TAKESHI; KITAZAWA, ATSUO
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 009295/0177 →
Assignment of Assignor's Interest Dec 24, 1998
From: SHINDO, TOYOHIKO; IMURA, KOICHI; IMAIZUMI, TAKAFUMI; ICHIKAWA, HIROYUKI
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 009695/0322 →
Assignment of Assignor's Interest Dec 1, 1999
From: TOYA, EIICHI; KONN, TOMIO; NAGATA, TOMOHIRO; SAITO, NORIHIKO
To: TOSHIBA CERAMICS CO., LTD.; TOKYO ELECTRON LIMITED
Reel/Frame 010430/0204 →
Assignment of Assignor's Interest Mar 29, 2001
From: TOYA, EIICHI; KONN, TOMIO; NAGATA, TOMOHIRO; SEKO, SUNAO
To: TOSHIBA CERAMICS CO., LTD.; TOKYO ELECTRON LIMITED
Reel/Frame 011660/0399 →
Assignment of Assignor's Interest May 25, 2001
From: SEKO, SUNAO; KONN, TOMIO; NAGATA, TOMOHIRO; SAITO, NORIHIKO
To: TOSHIBA CERAMICS CO., LTD.; TOKYO ELECTRON LIMITED
Reel/Frame 011844/0405 →
Assignment of Assignor's Interest Aug 1, 2002
From: FUJITA, MITSUHIRO; MORITA, KEIJI
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 013162/0570 →
Assignment of Assignor's Interest Jun 3, 2003
From: ABE, YOSHIHISA; SUZUKI, SHUNICHI; NAKANISHI, HIDEO; TERASHIMA, KAZUTAKA
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 014529/0103 →
Assignment of Assignor's Interest Jun 26, 2003
From: YOKOGAWA, MASANARI; HAGIHARA, HIROTAKA; WAGATSUMA, SHINYA; KITAYAMA, KOUTAROU
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 014254/0780 →
Assignment of Assignor's Interest Jul 14, 2003
From: SAITO, NORIHIKO; HONMA, HIROYUKI; MORI, HIROSHI; TOYA, EIICHI
To: TOSHIBA CERAMICS CO., LTD.; TOKYO ELECTRON LIMITED
Reel/Frame 014262/0302 →
Assignment of Assignor's Interest Sep 22, 2005
From: YOKOGAWA, MASANARI
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 017024/0291 →
Assignment of Assignor's Interest Dec 12, 2005
From: KOMIYAMA, JUN; ABE, YOSHIHISA; SUZUKI, SHUNICHI; NAKANISHI, HIDEO
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 017356/0641 →
Assignment of Assignor's Interest Oct 31, 2006
From: FUJITA, MITSUHIRO; IRIE, MASAKI
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 018484/0160 →
Assignment of Assignor's Interest Mar 30, 2007
From: SAITO, RYOUHEI; KIKUCHI, TOSHIYUKI; MISU, KIYOAKI; FUKUTANI, KAZUKO
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 019185/0069 →
Merger Jul 5, 2007
From: TOSHIBA CERAMICS CO., LTD.
To: COVALENT MATERIALS CORPORATION
Reel/Frame 019511/0735 →
Merger Sep 12, 2007
From: TOSHIBA CERAMICS CO., LTD.
To: COVALENT MATERIALS CORPORATION
Reel/Frame 019805/0793 →
Merger Sep 13, 2007
From: TOSHIBA CERAMICS CO., LTD.
To: COVALENT MATERIALS CORPORATION
Reel/Frame 019817/0749 →
Assignment of Assignor's Interest Oct 13, 2008
From: GOTO, HIROYUKI; MURAYAMA, HARUO; KIMIJIMA, SUSUMU; ICHISHIMA, MASAHIKO
To: COVALENT MATERIALS CORPORATION
Reel/Frame 021674/0208 →
Assignment of Assignor's Interest Oct 16, 2008
From: SAITO, NORIHIKO; TAKEDA, SOTARO
To: COVALENT MATERIALS CORPORATION
Reel/Frame 021692/0496 →
Assignment of Assignor's Interest Oct 13, 2023
From: COORSTEK KK
To: MOMENTIVE TECHNOLOGIES YAMAGATA KK
Reel/Frame 065211/0451 →
Change of Name May 2, 2024
From: COORSTEK KK
To: COORSTEK GK
Reel/Frame 067565/0354 →