IP Library Assignment 014529/0103
Patent Assignment
Reel/Frame 014529/0103

Assignment of Assignor's Interest

Recorded: 2003-06-03 Pages: 3
Assignors
ABE, YOSHIHISA
Executed: 2003-04-08
SUZUKI, SHUNICHI
Executed: 2003-04-08
NAKANISHI, HIDEO
Executed: 2003-04-08
TERASHIMA, KAZUTAKA
Executed: 2003-04-08
KOMIYAMA, JUN
Executed: 2003-04-08
Assignee
TOSHIBA CERAMICS CO., LTD.
5-25, NISHI-SHINJUKU 7-CHOME, SHINJUKU-KU, TOKYO 160-0023, JAPAN
Covered Property (1)
Semiconductor Wafer and Its Manufacturing Method
Patent: 6,936,490 →
Application: 10/432,597 →
Publication: US 2004/0053438
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Sep 13, 2007
From: TOSHIBA CERAMICS CO., LTD.
To: COVALENT MATERIALS CORPORATION
Reel/Frame 019817/0749 →
Change of Name & Address Apr 11, 2016
From: COVALENT MATERIALS CORPORATION
To: COORSTEK KK
Reel/Frame 038399/0880 →