Compound semiconductor substrate having multiple buffer layers
View Patent ↗The present invention provides a compound semiconductor substrate, including: a single-crystal silicon substrate having a crystal face with (111) orientation; a first buffer layer which is formed on the single-crystal silicon substrate and is constituted of an Al x Ga 1-x N single crystal (0<x≦1); a second buffer layer which is formed on the first buffer layer and is composed of a plurality of first unit layers each having a thickness of from 250 nm to 350 nm and constituted of an Al y Ga 1-y N single crystal (0≦y<0.1) and a plurality of second unit layers each having a thickness of from 5 nm to 20 nm and constituted of an Al z Ga 1-z N single crystal (0.9<z≦1), said pluralities of first and second unit layers having been alternately superposed; and a semiconductor device formation region which is formed on the second buffer layer and includes at least one nitride-based semiconductor single-crystal layer. The compound semiconductor substrate according to the invention is suitable for use in electronic devices such as HEMTs (high electron mobility transistors).
1. A compound semiconductor substrate, comprising:
a single-crystal silicon substrate having a crystal face with (111) orientation;
a first buffer layer which is formed on the single-crystal silicon substrate and is constituted of an Al x Ga 1-x N single crystal (0<x≦1);
a second buffer layer which is formed on the first buffer layer and is composed of a plurality of first unit layers each having a thickness of from 250 nm to 350 nm and constituted of an Al y Ga 1-y N single crystal (0≦y<0.1) and a plurality of second unit layers each having a thickness of from 5 nm to 20 nm and constituted of an Al z Ga 1-z N single crystal (0.9<z≦1), said pluralities of first and second unit layers having been alternately superposed; and
a semiconductor device formation region which is formed on the second buffer layer and comprises at least one nitride-based semiconductor single-crystal layer.
2. The compound semiconductor substrate according to claim 1 , wherein the first buffer layer comprises:
an AlN unit layer which is formed on the single-crystal silicon substrate and is constituted of an AlN single crystal (x=1), and
an AlGaN unit layer which is formed on the AlN unit layer and is constituted of an Al x Ga 1-x N single crystal (0<x<1).
3. The compound semiconductor substrate according to claim 1 , wherein the plurality of first unit layers each are constituted of a GaN single crystal (y=0), and the plurality of second unit layers each are constituted of an AlN single crystal (z=1).