IP Library Assignment 024184/0087
Patent Assignment
Reel/Frame 024184/0087

Assignment of Assignor's Interest

Recorded: 2010-03-25 Pages: 4
Assignors
OISHI, HIROSHI
Executed: 2010-03-19
KOMIYAMA, JUN
Executed: 2010-03-19
ERIGUCHI, KENICHI
Executed: 2010-03-19
ABE, YOSHIHISA
Executed: 2010-03-19
YOSHIDA, AKIRA
Executed: 2010-03-19
SUZUKI, SHUNICHI
Executed: 2010-03-19
Assignee
COVALENT MATERIALS CORPORATION
6-3, OHSAKI-CHOME, SHINAGAWA-KU, TOKYO, 141-0032, JAPAN
Covered Property (1)
Compound semiconductor substrate having multiple buffer layers
Patent: 8,148,753 →
Application: 12/659,927 →
Publication: US 2010/0244100
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name & Address Apr 11, 2016
From: COVALENT MATERIALS CORPORATION
To: COORSTEK KK
Reel/Frame 038399/0880 →