IP Library Assignment 024966/0259
Patent Assignment
Reel/Frame 024966/0259

Assignment of Assignor's Interest

Recorded: 2010-09-10 Pages: 4
Assignors
KOMIYAMA, JUN
Executed: 2010-07-23
ERIGUCHI, KENICHI
Executed: 2010-07-23
OISHI, HIROSHI
Executed: 2010-07-23
ABE, YOSHIHISA
Executed: 2010-07-23
YOSHIDA, AKIRA
Executed: 2010-07-23
SUZUKI, SHUNICHI
Executed: 2010-07-23
Assignee
COVALENT MATERIALS CORPORATION
6-3, OHSAKI 1-CHOME, SHINAGAWA-KU, TOKYO, JAPAN
Covered Property (1)
Compound Semiconductor Substrate Comprising a Multilayer Buffer Layer
Patent: 8,212,288 →
Application: 12/879,035 →
Publication: US 2011/0062556
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name & Address Apr 11, 2016
From: COVALENT MATERIALS CORPORATION
To: COORSTEK KK
Reel/Frame 038399/0880 →
Change of Name May 2, 2024
From: COORSTEK KK
To: COORSTEK GK
Reel/Frame 067565/0354 →