Compound semiconductor substrate
A compound semiconductor substrate according to the present invention includes a compound semiconductor layer formed on one main surface of a ground substrate via a seed layer, wherein the ground substrate is formed of a sintered body, the seed layer is formed of a single crystal, the compound semiconductor layer includes a structure having a buffer layer and an active layer that are sequentially crystal-grown on the seed layer, a thermal expansion coefficient of the sintered body is 0.7 times or more and 1.4 times or less an average thermal expansion coefficient of the entire compound semiconductor layer, and an FWHM of an X-ray diffraction peak of the buffer layer obtained by an X-ray diffraction rocking curve measurement is 800 arcsec or less.
1. A compound semiconductor substrate comprising:
a compound semiconductor layer formed on one main surface of a ground substrate via a seed layer, wherein
the ground substrate is formed of a sintered body,
the seed layer is formed of a single crystal,
the compound semiconductor layer includes a structure having a buffer layer and an active layer that are sequentially crystal-grown on the seed layer,
a thermal expansion coefficient of the sintered body is 0.7 times or more and 1.4 times or less an average thermal expansion coefficient of the entire compound semiconductor layer, and
an FWHM of an X-ray diffraction peak of the buffer layer is 800 arcsec or less, and a layer thickness of the compound semiconductor layer is 7 μm or more and 15 μm or less.
2. The compound semiconductor substrate according to claim 1 , wherein the active layer is one obtained by forming an electron supply layer on an electron transit layer.
3. The compound semiconductor substrate according to claim 2 , wherein a spacer layer is further provided between the electron transit layer and the electron supply layer.
4. The compound semiconductor substrate according to claim 1 , wherein
the ground substrate is an aluminum nitride (AlN) sintered body,
the seed layer is a silicon (Si) single crystal manufactured by the Czochralski (CZ) method or the Floating Zone (FZ) method,
the compound semiconductor is a gallium-based nitride manufactured by a vapor phase growth method, and
the FWHM of GaN (002) and GaN (100) X-ray diffraction peaks of the buffer layer are both 500 arcsec or less.
5. The compound semiconductor substrate according to claim 2 , wherein
the ground substrate is an aluminum nitride (AlN) sintered body,
the seed layer is a silicon (Si) single crystal manufactured by the Czochralski (CZ) method or the Floating Zone (FZ) method,
the compound semiconductor is a gallium-based nitride manufactured by a vapor phase growth method, and
the FWHM of GaN (002) and GaN (100) X-ray diffraction peaks of the buffer layer are both 500 arcsec or less.
6. The compound semiconductor substrate according to claim 3 , wherein
the ground substrate is an aluminum nitride (AlN) sintered body,
the seed layer is a silicon (Si) single crystal manufactured by the Czochralski (CZ) method or the Floating Zone (FZ) method,
the compound semiconductor is a gallium-based nitride manufactured by a vapor phase growth method, and
the FWHM of GaN (002) and GaN (100) X-ray diffraction peaks of the buffer layer are both 500 arcsec or less.