Patent Assignment
Reel/Frame 029962/0497
Assignment of Assignor's Interest
Recorded: 2013-03-11
Pages: 4
Assignor
COVALENT MATERIALS CORPORATION
Executed: 2012-12-26
Assignee
COVALENT SILICON CORPORATION
6-861-5, SEIRO-MACHI HIGASHIKO, KITAKANBARA-GUN, NIIGATA, 957-0197, JAPAN
Covered Properties
(34)
Manufacturing Method of a Silicon Wafer Having a Controlled Bmd Concentration
Patent:
5,788,763 →
Application:
08/612,214 →
Hydrogen Heat Treatment Method of Silicon Wafers Using a High-Purity Inert Substitution Gas
Patent:
6,066,579 →
Application:
08/781,026 →
Vapor Deposition Apparatus and Method for Forming Thin Film
Patent:
6,059,885 →
Application:
08/991,407 →
Method of and Apparatus for Removing Metallic Impurities Diffused in a Semiconductor Substrate
Patent:
6,054,373 →
Application:
09/006,996 →
High-Speed Rotational Vapor Deposition Apparatus and High-Speed Rotational Vapor Deposition Thin Film Forming Method
Patent:
6,113,705 →
Application:
09/137,298 →
Method for Making a Slant-Surface Silicon Wafer Having a Reconstructed Atomic-Level Stepped Surface Structure
Patent:
5,966,625 →
Application:
09/187,038 →
Wafer heating device and method of controlling the same
Patent:
6,250,914 →
Application:
09/556,943 →
Wafer Defect Measuring Method and Apparatus
Patent:
6,734,960 →
Application:
09/589,087 →
Method and Apparatus for Controlling Rise and Fall of Temperature in Semiconductor Substrates
Polishing Apparatus and Method Thereof
Single Crystal Pulling Apparatus and Pulling Method
Method of Chemically Growing a Thin Film in a Gas Phase on a Silicon Semiconductor Substrate
Apparatus for Pulling a Single Crystal
Silicon Wafer Cleaning Method
Silicon Seed Crystal and Method for Manufacturing Silicon Single Crystal
Silicon Single Crystal Wafer Fabricating Method and Silicon Single Crystal Wafer
Polishing Head and Polishing Apparatus
A Semiconductor Substrate Comprising a Support Substrate Which Comprises a Gettering Site
Manufacturing Method for Strained Silicon Wafer
Process of Producing Silicon Wafer
Method of Manufacturing Silicon Wafer
Surface Inspection Apparatus and Surface Inspection Method
Surface Inspection Apparatus and Surface Inspection Method for Strained Silicon Wafer
Single Crystal Pulling Apparatus
Manufacturing Method for Silicon Wafer
Method of Manufacturing Single Crystal Silicon Wafer from Ingot Grown by Czocharlski Process with Rapid Heating/Cooling Process
Method for Production of Silicon Wafer for Epitaxial Substrate and Method for Production of Epitaxial Substrate
Method of Heat Treating Silicon Wafer
Silicon Wafer
Method of Pulling Up Silicon Single Crystal
Application:
13/036,196 →
Publication:
US 2011/0214603
Single Crystal Pulling-Up Apparatus of Pulling-Up Silicon Single Crystal and Single Crystal Pulling-Up Method of Pulling-Up Silicon Single Crystal
Silicon Wafer and Method for Heat-Treating Silicon Wafer
Method for Heat Treating a Silicon Wafer
Thermal Treatment Method of Silicon Wafer and Silicon Wafer
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 29, 1996
From: HAYASHI, KENRO; TAKEDA, RYUJI; CHAKI, KATSUHIRO; SAITO,HIROYUKI
To: TOSHIBA CERAMICS CO.,LTD.
Reel/Frame 007980/0623 →
Assignment of Assignor's Interest
Nov 14, 1996
From: HAYASHI, KENRO; TAKEDA, RYUJI; CHAKI, KATSUHIRO; XIN, PING
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 008262/0358 →
Assignment of Assignor's Interest
Jan 9, 1997
From: MATSUSHITA, JUNICHI; YOSHIKAWA, JUN; SANADA, MASAYUKI; SHIMIZU, TATSUYA
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 008402/0699 →
Assignment of Assignor's Interest
May 6, 1998
From: OHASHI, TADASHI; CHAKI, KATUHIRO; XIN, PING; FUJII, TATSUO
To: TOSHIBA CERAMICS CO., LTD.; TOSHIBA KIKAI KABUSHIKIKAISHA
Reel/Frame 009151/0147 →
Assignment of Assignor's Interest
Jun 8, 1998
From: TOMITA, HIROSHI; MURAOKA, HISASHI; TAKEDA, RYUJI
To: KABUSHIKI KAISHA TOSHIBA; PUREX CO., LTD.; TOSHIBA CERAMICS CO., LTD.
Reel/Frame 009234/0097 →
Assignment of Assignor's Interest
Nov 20, 1998
From: OHASHI, TADASHI; CHAKI, KATUHIRO; XIN, PING; FUJII, TATSUO
To: TOSHIBA CERAMICS CO., LTD.; TOSHIBA KIKAI KABUSHIKIKAISHA
Reel/Frame 009602/0696 →
Assignment of Assignor's Interest
Apr 21, 2000
From: KATSUMATA, HIROFUMI; ITO, HIDEKI; TAKAHASHI, HIDENORI; OHASHI, TADASHI
To: TOSHIBA MACHINE CO., LTD.; TOSHIBA CERAMICS CO., LTD.
Reel/Frame 010747/0990 →
Assignment of Assignor's Interest
Sep 18, 2000
From: GOTO, HIROYUKI; SAITO, HIROYUKI; FUJINAMI, MAKIKO; SHIRAI, HIROSHI
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 011093/0566 →
Assignment of Assignor's Interest
Apr 16, 2001
From: TOBASHI, SHYUJI; OHASHI, TADASHI; IWATA, KATSUYUKI; SAITO, HIROYUKI
To: TOSHIBA CERAMICS CO., LTD.; TOSHIBA KIKAI KABUSHIKIKAISHA
Reel/Frame 011711/0983 →
Assignment of Assignor's Interest
May 4, 2001
From: SAKAMOTO, TAKAO; KAWAMOTO, SHINYA; KOTARI, KATSUAKI; KOJIMA, KATSUYOSHI
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 011769/0686 →
Assignment of Assignor's Interest
Jun 20, 2001
From: MIURA, HIROYUKI; IWATA, YASUYUKI; KONDOH, SHINSUKE
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 011918/0345 →
Assignment of Assignor's Interest
Aug 6, 2001
From: TOBASHI, SHUJI; OHASHI, TADASHI; MITANI, SHINICHI; ARAI, HIDEKI
To: TOSHIBA CERAMICS CO., LTD.; TOSHIBA KIKAI KABUSHIKIKAISHA
Reel/Frame 012061/0121 →
Assignment of Assignor's Interest
Aug 22, 2003
From: KURITA, HISATSUGU; HIRASAWA, MANABU; NAGAHAMA, HIROMI; IZUMOME, KOJI
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 014424/0822 →
Assignment of Assignor's Interest
Dec 31, 2003
From: SHIMOSAKA, MAKOTO; ABE, SUNAO
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 014847/0187 →
Assignment of Assignor's Interest
Dec 2, 2004
From: MASANAGA, TAKAYUKI; OOFUCHI, SHINOBU; ISOGAI, HIROMICHI; KOJIMA, KATSUYOSHI
To: KABUSHIKI KAISHA TOSHIBA; TOSHIBA CERAMICS CO., LTD.
Reel/Frame 016049/0781 →
Assignment of Assignor's Interest
Dec 17, 2004
From: WATANABE, MASAYUKI
To: TOSHIBA CERAMICS CO., .LTD.
Reel/Frame 016085/0304 →
Assignment of Assignor's Interest
Jan 21, 2005
From: KURITA, HISATSUGU; IGARASHI, MASATO; SENDA, TAKESHI; IZUNOME, KOJI
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 016220/0944 →
Assignment of Assignor's Interest
Mar 3, 2005
From: YOSHIMURA, REIKO; TADA, OSAMU; IZUNOME, KOJI; KASHIMA, KAZUHIRO
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 016324/0306 →
Corrective Coversheet to Correct the Name of the Assignor Previously Recorded on Reel 016049, Frame 0781.
Jun 21, 2005
From: MASUNAGA, TAKAYUKI; OOFUCHI, SHINOBU; ISOGAI, HIROMICHI; KOJIMA, KATSUYOSHI
To: KABUSHIKI KAISHA TOSHIBA; TOSHIBA CERAMICS CO., LTD.
Reel/Frame 016711/0303 →
Assignment of Assignor's Interest
Aug 19, 2005
From: HIRANO, YUMIKO
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 016886/0542 →
Assignment of Assignor's Interest
Aug 15, 2006
From: TOSHIBA KIKAI KABUSHIKIKAISHA
To: NUFLARE TECHNOLOGY, INC.
Reel/Frame 018120/0348 →
Change of Address
Sep 22, 2006
From: TOSHIBA CERAMICS CO., LTD.
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 018291/0382 →
Corrective Assignment to Correct the 2ND Inventor's First Name and 4TH Inventor's First Name Previously Recorded on Reel 016324 Frame 0306. Assignor(S) Hereby Confirms the Assignment.
Jan 17, 2007
From: YOSHIMURA, REIKO; TADA, TSUKASA; IZUNOME, KOJI; KASHIMA, KAZUHIKO
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 018766/0307 →
Assignment of Assignor's Interest
Jan 23, 2007
From: TOSHIBA MACHINE CO., LTD.
To: NUFLARE TECHNOLOGY, INC.
Reel/Frame 018787/0713 →
Merger
Jul 5, 2007
From: TOSHIBA CERAMICS CO., LTD.
To: COVALENT MATERIALS CORPORATION
Reel/Frame 019511/0735 →