Granted Patent
Utility
US 6,250,914 · App. 09/556,943
Wafer heating device and method of controlling the same
Inventors:
Hirofumi Katsumata, Hideki Ito, Hidenori Takahashi, Tadashi Ohashi, Shuji Tobashi, Katsuyuki Iwata
Patented Case
View Patent ↗
Granted: Jun 26, 2001
Filed: Apr 21, 2000
Inventors
Hirofumi Katsumata
Hideki Ito
Hidenori Takahashi
Tadashi Ohashi
Shuji Tobashi
Katsuyuki Iwata
Assignees (at issue)
TOSHIBA MACHINE CO., LTD.
Toshiba Ceramics Co., Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.