Polishing head and polishing apparatus
View Patent ↗A polishing head includes a head body, a first recessed portion formed in the lower surface of the head body, a support plate which can be moved up and down in the first recessed portion, a first film-like member in which a first space is formed between the upper surface of the support plate and the head body, a second recessed portion formed in a lower surface of the support plate, a second film-like member, in which a second space is formed between the second film-like member and the support plate, and which holds a wafer on the lower, a communicating hole which is formed in the support plate to communicate the first space with the second space, and a gas supply device which increases pressures in the first and second spaces with a fluid to equal pressures to bring the object into press contact with the polishing pad.
1. A polishing head comprising:
a head body which is arranged to oppose a polishing surface of a polishing pad;
a first recessed portion which is formed in a surface of the head body, the surface opposing the polishing pad;
a support plate which is arranged in the first recessed portion, substantially in parallel with the polishing surface and which can be moved in directions in which the support plate is brought into contact with the head body or separated from the head body;
a first film-like member which is arranged to extend from a surface of the support plate, the surface opposing the head body, to an inner surface of the first recessed portion and in which a first space is formed between a surface of the support plate, the surface being on the counter side of the polishing pad, and the head body;
a second recessed portion which is formed in the surface of the support plate, the surface opposing the polishing pad;
a second film-like member which is formed on the surface of the support plate, the surface opposing the polishing pad, to seal the second recessed portion, in which a second space is formed between the second film-like member and the support plate, and which holds an object to be processed on a surface opposing the polishing pad;
a communicating hole which is formed in the support plate to communicate the first space with the second space;
a pressure device which increases pressures in the first space and the second space with a fluid to equal pressures to bring the object into press contact with the polishing pad through the second film-like member; and
a retainer which is arranged on a surface of the head body, the surface opposing the polishing pad, which surrounds the object, and which is brought into contact with the polishing pad.
2. The polishing head according to claim 1 , further comprising an alignment member which is arranged on one of the head body and the support plate to support a surface of the first film-like member, the surface opposing the polishing pad, and wherein
a support area of the first film-like member is changed by the alignment member to adjust a depressing force acting on the support plate by the pressure in the first space, thereby controlling a position of the support plate based on the head body.
3. The polishing head according to claim 2 , wherein the alignment member is detachably arranged on the head body and includes a ring-like member which supports an outer peripheral portion of a surface of the first film-like member, the surface opposing the polishing pad.
4. The polishing head according to claim 2 , wherein the alignment member is detachably arranged on an inner peripheral portion of the head body and includes a ring-like member which supports an outer peripheral portion of the surface of the first film-like member, the surface opposing the polishing pad.
5. The polishing head according to claim 2 , wherein the alignment member is detachably arranged on the support plate and includes a ring-like member which supports an inner peripheral portion of the surface of the first film-like member, the surface opposing the polishing pad.
6. The polishing head according to claim 2 , wherein the alignment member is detachably arranged on the outer peripheral portion of the support plate and includes a ring-like member which supports an inner peripheral portion of the surface of the first film-like member, the surface opposing the polishing pad.
7. The polishing head according to claim 2 , wherein the alignment member is arranged in such a state that the alignment member overlaps the head body and includes a plurality of ring-like member having a plurality of projecting portions formed on inner peripheral surfaces of the ring-like members.
8. The polishing head according to claim 2 , wherein
the alignment member includes:
a ring-like support member which is fixed to the head body and which has a plurality of insertion holes formed at predetermined intervals in a circumferential direction; and
insertion plates which are movably inserted into the insertion holes and which project on the inside of the support member in a radial direction to support an outer peripheral portion of the surface of the first film-like member, the surface opposing the polishing pad.
9. The polishing head according to claim 2 , further comprising a drive device to change a support area of the first film-like member.
10. The polishing head according to claim 8 , wherein curved portions are formed on an inner surface of the insertion hole and the insertion plate, respectively, and the curved portion formed on the inner surface of the insertion hole is engaged with the curved portion formed on the insertion plate to keep depth the insertion plate at a desired.
11. A polishing apparatus comprising:
a polishing pad having a polishing surface for polishing an object to be processed; and
a polishing head which arranged to oppose the polishing surface and which holds the object to bring the object into press contact with the polishing surface, and wherein
the polishing head comprises:
a head body which is arranged to oppose the polishing surface of the polishing pad;
a first recessed portion which is formed in a surface of the head body, the surface opposing the polishing pad;
a support plate which is arranged in the first recessed portion, substantially in parallel with the polishing surface and which can be moved in directions in which the support plate is brought into contact with the head body or separated from the head body;
a first film-like member which is arranged to extend from a surface of the support plate, the surface opposing the head body, to an inner surface of the first recessed portion and in which a first space is formed between a surface of the support plate, the surface being on the counter side of the polishing pad, and the head body;
a second recessed portion which is formed in the surface of the support plate, the surface opposing the polishing pad;
a second film-like member which is formed on the surface of the support plate, the surface opposing the polishing pad, to seal the second recessed portion, in which a second space is formed between the second film-like member and the support plate, and which holds an object to be processed on a surface opposing the polishing pad;
a communicating hole which is formed in the support plate to communicate the first space with the second space;
a pressure device which increases pressures in the first space and the second space with a fluid to equal pressures to bring the object into press contact with the polishing pad through the second film-like member; and
a retainer which is arranged on a surface of the head body, the surface opposing the polishing pad, which surrounds the object, and which is brought into contact with the polishing pad.