Patent Assignment
Reel/Frame 010747/0990
Assignment of Assignor's Interest
Recorded: 2000-04-21
Pages: 3
Assignors
KATSUMATA, HIROFUMI
Executed: 2000-04-06
ITO, HIDEKI
Executed: 2000-04-06
TAKAHASHI, HIDENORI
Executed: 2000-04-06
OHASHI, TADASHI
Executed: 2000-04-11
TOBASHI, SHUJI
Executed: 2000-04-11
IWATA, KATSUYUKI
Executed: 2000-04-11
Assignees
TOSHIBA MACHINE CO., LTD.
CHUO-KU, 2-11, 4-CHOME GINZA,, TOKYO, JAPAN
TOSHIBA CERAMICS CO., LTD.
NISHI-SHINJUKU-KU, 5-25 7-CHOME, TOKYO, JAPAN
Covered Property
(1)
Wafer heating device and method of controlling the same
Patent:
6,250,914 →
Application:
09/556,943 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 23, 2007
From: TOSHIBA MACHINE CO., LTD.
To: NUFLARE TECHNOLOGY, INC.
Reel/Frame 018787/0713 →
Merger
Sep 13, 2007
From: TOSHIBA CERAMICS CO., LTD.
To: COVALENT MATERIALS CORPORATION
Reel/Frame 019817/0749 →
Assignment of Assignor's Interest
Mar 11, 2013
From: COVALENT MATERIALS CORPORATION
To: COVALENT SILICON CORPORATION
Reel/Frame 029962/0497 →
Change of Name
Mar 13, 2013
From: COVALENT SILICON CORPORATION
To: GLOBALWAFERS JAPAN CO., LTD.
Reel/Frame 029991/0421 →