IP Library Assignment 016324/0306
Patent Assignment
Reel/Frame 016324/0306

Assignment of Assignor's Interest

Recorded: 2005-03-03 Pages: 3
Assignors
YOSHIMURA, REIKO
Executed: 2005-01-26
TADA, OSAMU
Executed: 2005-01-26
IZUNOME, KOJI
Executed: 2005-01-26
KASHIMA, KAZUHIRO
Executed: 2005-01-26
Assignee
TOSHIBA CERAMICS CO., LTD.
5-25, NISHI-SHINJUKU 7-CHOME, SHINJUKU-KU, TOKYO, JAPAN
Covered Property (1)
A Semiconductor Substrate Comprising a Support Substrate Which Comprises a Gettering Site
Patent: 7,193,294 →
Application: 11/002,995 →
Publication: US 2006/0118868
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the 2ND Inventor's First Name and 4TH Inventor's First Name Previously Recorded on Reel 016324 Frame 0306. Assignor(S) Hereby Confirms the Assignment. Jan 17, 2007
From: YOSHIMURA, REIKO; TADA, TSUKASA; IZUNOME, KOJI; KASHIMA, KAZUHIKO
To: TOSHIBA CERAMICS CO., LTD.
Reel/Frame 018766/0307 →
Merger Sep 13, 2007
From: TOSHIBA CERAMICS CO., LTD.
To: COVALENT MATERIALS CORPORATION
Reel/Frame 019817/0749 →
Assignment of Assignor's Interest Mar 11, 2013
From: COVALENT MATERIALS CORPORATION
To: COVALENT SILICON CORPORATION
Reel/Frame 029962/0497 →
Change of Name Mar 13, 2013
From: COVALENT SILICON CORPORATION
To: GLOBALWAFERS JAPAN CO., LTD.
Reel/Frame 029991/0421 →