Method of heat treating silicon wafer
View Patent ↗In a method of heat treating a wafer obtained by slicing a silicon single crystal ingot manufactured by the Czochralski method, a rapid heating/cooling heat treatment is carried out by setting a holding time at an ultimate temperature of 1200° C. or more and a melting point of silicon or less to be equal to or longer than one second and to be equal to or shorter than 60 seconds in a mixed gas atmosphere containing oxygen having an oxygen partial pressure of 1.0% or more and 20% or less and argon, and an oxide film having a thickness of 9.1 nm or less or 24.3 nm or more is thus formed on a surface of the silicon wafer.
1. A method of heat treating a silicon wafer, said method comprising:
carrying out a rapid heating/cooling heat treatment for fanning an oxide film having a thickness of 5.9 nm or more and 9.1 nm or less on a surface of the silicon wafer in an oxygen containing atmosphere,
wherein an ultimate temperature in the rapid heating/cooling heat treatment is set to be equal to or higher than 1300° C. and to be equal to or lower than a melting point of silicon.
2. The method according to claim 1 , the silicon wafer is obtained by slicing a silicon single crystal ingot manufactured by Czochralski method.
3. The method according to claim 1 , wherein the ultimate temperature in the rapid heating/cooling heat treatment is set to be equal to or higher than 1300° C. and to be equal to or lower than 1380° C.
4. The method according to claim 1 , wherein an oxygen partial pressure is set to be equal to or higher than 1.0% and to be equal to or lower than 20% in the oxygen containing atmosphere.
5. The method according to claim 1 , wherein the oxygen containing atmosphere is constituted by argon and oxygen.
6. The method according to claim 1 , wherein a holding time at the ultimate temperature is set to be equal to or longer than one second and to be equal to or shorter than 60 seconds.
7. The method according to claim 1 , wherein a temperature rising speed in the rapid heating/cooling heat treatment is set to be equal to or higher than 10° C./second and to be equal to or lower than 150° C./second.
8. The method according to claim 1 , wherein a temperature falling speed in the rapid heating/cooling heat treatment is set to be equal to or higher than 10° C./second and to be equal to or lower than 150° C./second.