IP Library › Assignment 023876/0957
Patent Assignment
Reel/Frame 023876/0957

Assignment of Assignor's Interest

Recorded: 2010-01-21 Pages: 5
Assignors
SENDA, TAKESHI
Executed: 2010-01-12
ISOGAI, HIROMICHI
Executed: 2010-01-12
TOYODA, EIJI
Executed: 2010-01-12
MURAYAMA, KUMIKO
Executed: 2010-01-12
Assignee
COVALENT MATERIALS CORPORATION
6-3, OHSAKI 1-CHOME, SHINAGAWA-KU, TOKYO, 141-0032, JAPAN
Covered Property (1)
Method of Heat Treating Silicon Wafer
Patent: 8,252,700 →
Application: 12/656,232 →
Publication: US 2010/0197146
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 11, 2013
From: COVALENT MATERIALS CORPORATION
To: COVALENT SILICON CORPORATION
Reel/Frame 029962/0497 →
Change of Name Mar 13, 2013
From: COVALENT SILICON CORPORATION
To: GLOBALWAFERS JAPAN CO., LTD.
Reel/Frame 029991/0421 →