IP Library › Assignment 017904/0028
Patent Assignment
Reel/Frame 017904/0028

Assignment of Assignor's Interest

Recorded: 2006-05-16 Pages: 3
Assignors
SUNG, SHING-LI
Executed: 2006-05-15
LEE, WONSEOK
Executed: 2006-05-12
WANG, JUDY
Executed: 2006-05-12
MA, SHAWING
Executed: 2006-05-12
Assignee
APPLIED MATERIALS, INC.
P.O. BOX 450A, LEGAL AFFAIRS DEPT., M/S 2061-LEGAL, SANTA CLARA, CALIFORNIA, 95052
Covered Property (1)
Dielectric Plasma Etch Process with in-Situ Amorphous Carbon Mask with Improved Critical Dimension and Etch Selectivity
Patent: 7,510,976 →
Application: 11/434,951 →
Publication: US 2007/0249171