Patent Assignment
Reel/Frame 017912/0756
Assignment of Assignor's Interest
Recorded: 2006-05-22
Pages: 3
Assignor
LEE, SHENG-YUAN
Executed: 2006-01-17
Assignee
VIA TECHNOLOGIES, INC.
8F, NO. 535, CHUNG-CHENG RD., HSIN-TIEN CITY, TAIPEI HSIEN, R.O.C., TAIWAN
Covered Property
(1)
Embedded Inductor Element and Chip Package Applying the Same