Patent Assignment
Reel/Frame 017933/0336
Assignment of Assignor's Interest
Recorded: 2005-11-15
Pages: 3
Assignors
ITOH, DAISUKE
Executed: 2005-11-08
IZUMITANI, AKIHITO
Executed: 2005-11-08
HATA, NORIAKI
Executed: 2005-11-08
MATSUBA, YORISHIGE
Executed: 2005-11-08
Assignee
HARIMA CHEMICALS, INC.
671-4, MIZUASHI, NOGUCHICHO, KAKOGAWA-SHI, HYOGO 657-0019, JAPAN
Covered Property
(1)
Method for Forming Fine Copper Particle Sintered Product Type of Electric Conductor Having Fine Shape, and Process for Forming Copper Fine Wiring and Thin Copper Film by Applying Said Method