IP Library › Assignment 017936/0400
Patent Assignment
Reel/Frame 017936/0400

Assignment of Assignor's Interest

Recorded: 2006-05-30 Pages: 3
Assignors
LEE, SEON GOO
Executed: 2006-04-17
HAHM, HUN JOO
Executed: 2006-04-17
KIM, DAE YEON
Executed: 2006-04-17
SONG, YOUNG JAE
Executed: 2006-04-17
PARK, YOUNG SAM
Executed: 2006-04-17
SONG, CHANG HO
Executed: 2006-04-17
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN-3-DONG, YOUNGTONG-KU, SUWON, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property (1)
High Power Light Emitting Diode Package and Fabrication Method Thereof
Patent: 7,663,199 →
Application: 11/442,414 →
Publication: US 2006/0267036
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 22, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024723/0532 →
Merger Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →