Assignment of Assignor's Interest

Recorded: 2006-05-26 Pages: 3

Assignors

ARAI, KUNIO

Executed: 2006-04-03

SUGAWARA, HIROYUKI

Executed: 2006-04-05

ASHIZAWA, HIROAKI

Executed: 2006-04-03

NISHIYAMA, HIROMI

Executed: 2006-04-07

Assignee

HITACHI VIA MECHANICS, LTD.

2100 KAMIIMAIZUMI, EBINA-SHI, KANAGAWA, 243-0488, JAPAN

Covered Property (1)

Method and Apparatus for Laser Perforating Printed Circuit Board

Patent: 7,531,767 →

Application: 11/365,657 →

Publication: US 2006/0211158

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.