Patent Assignment
Reel/Frame 017938/0270
Assignment of Assignor's Interest
Recorded: 2006-05-31
Pages: 2
Assignor
KATOH, TAKAYUKI
Executed: 2006-05-11
Assignee
MITSUBISHI DENKI KABUSHIKI KAISHA
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8310, JAPAN
Covered Property
(1)
Method of Inspecting Semiconductor Device Chip Patterns on a Wafer