Patent Assignment
Reel/Frame 017939/0210
Assignment of Assignor's Interest
Recorded: 2006-05-30
Pages: 3
Assignor
ISHIZAKA, TADAHIRO
Executed: 2006-03-31
Assignee
TOKYO ELECTRON LIMITED
3-6, AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-8481, JAPAN
Covered Property
(1)
Method of Plasma Enhanced Atomic Layer Deposition of Tac and Tacn Films Having Good Adhesion to Copper