IP Library Assignment 017943/0358
Patent Assignment
Reel/Frame 017943/0358

Assignment of Assignor's Interest

Recorded: 2005-11-18 Pages: 2
Assignors
KUMASHIRO, YASUSHI
Executed: 2005-11-09
HIRATA, YOSHITAKA
Executed: 2005-11-09
TAKANEZAWA, SHIN
Executed: 2005-11-09
SHIMADA, YASUSHI
Executed: 2005-11-09
OTSUKA, KAZUHISA
Executed: 2005-11-09
KURIYA, HIROYUKI
Executed: 2005-11-09
YAMAMOTO, KAZUNORI
Executed: 2005-11-09
Assignee
HITACHI CHEMICAL CO., LTD.
1-1, NISHISHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO 163-0449, JAPAN
Covered Property (1)
Insulation Material, Film, Circuit Board and Method of Producing Them
Patent: 7,700,185 →
Application: 10/557,890 →
Publication: US 2007/0060672
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →