IP Library › Assignment 017953/0272
Patent Assignment
Reel/Frame 017953/0272

Assignment of Assignor's Interest

Recorded: 2006-06-02 Pages: 3
Assignors
LEE, SEON GOO
Executed: 2006-05-23
HAHM, HUN JOO
Executed: 2006-05-23
PARK, JUNG KYU
Executed: 2006-05-23
HAN, KYUNG TAEG
Executed: 2006-05-23
HAN, SEONG YEON
Executed: 2006-05-23
KIM, DAE YEON
Executed: 2006-05-23
PARK, YOUNG SAM
Executed: 2006-05-23
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD
314 MAETAN 3-DONG, YOUNGTONG-KU SUWON, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property (1)
High Power Led Package and Fabrication Method Thereof
Patent: 7,626,250 →
Application: 11/445,227 →
Publication: US 2006/0273338
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 22, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024723/0532 →
Merger Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →