Patent Assignment
Reel/Frame 017960/0773
Assignment of Assignor's Interest
Recorded: 2006-06-05
Pages: 4
Assignor
MORIYAMA, EIJI
Executed: 2006-05-23
Assignees
RICOH COMPANY, LTD.
3-6, NAKAMAGOME 1-CHOME, OHTA-KU, TOKYO 143-8555, JAPAN
RICOH MICROELECTRONICS CO., LTD.
10-3, KITAMURA, TOTTORI-SHI, TOTTORI 680-1172, JAPAN
Covered Property
(1)
Wiring Board, Electronic Circuit Board, Electronic Apparatus and Manufacturing Method of Electronic Circuit Board