IP Library Assignment 017966/0918
Patent Assignment
Reel/Frame 017966/0918

Assignment of Assignor's Interest

Recorded: 2006-06-01 Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2006-06-01
YEH, MING-SHIH
Executed: 2006-06-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, ROC 300-77, TAIWAN
Covered Property (1)
Interconnection Structure Design for Low Rc Delay and Leakage
Patent: 8,432,040 →
Application: 11/444,629 →
Publication: US 2007/0278681
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 30, 2023
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
To: ADVANCED MANUFACTURING INNOVATIONS INC.
Reel/Frame 064180/0278 →