IP Library Assignment 017987/0004
Patent Assignment
Reel/Frame 017987/0004

Assignment of Assignor's Interest

Recorded: 2006-06-12 Pages: 4
Assignors
MARCROPOULOS, WILLIAM
Executed: 2006-03-27
MENDOLIA, GREG
Executed: 2006-03-27
OAKES, JAMES G.
Executed: 2006-03-31
KHAYO, IZZ
Executed: 2006-03-27
Assignee
PARATEK MICROWAVE, INC.
6925 OAKLAND MILLS ROAD #STE L, COLUMBIA, MARYLAND, 21045
Covered Property (1)
Optimized Circuits for Three Dimensional Packaging and Methods of Manufacture Therefore
Patent: 7,471,146 →
Application: 11/353,930 →
Publication: US 2006/0214165
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jul 31, 2012
From: PARATEK MICROWAVE, INC.
To: RESEARCH IN MOTION RF, INC.
Reel/Frame 028686/0432 →
Assignment of Assignor's Interest Jul 30, 2013
From: RESEARCH IN MOTION RF, INC.
To: RESEARCH IN MOTION CORPORATION
Reel/Frame 030909/0908 →
Assignment of Assignor's Interest Jul 30, 2013
From: RESEARCH IN MOTION CORPORATION
To: BLACKBERRY LIMITED
Reel/Frame 030909/0933 →
Assignment of Assignor's Interest Mar 5, 2020
From: BLACKBERRY LIMITED
To: NXP USA, INC.
Reel/Frame 052095/0443 →