Patent Assignment
Reel/Frame 017991/0082
Assignment of Assignor's Interest
Recorded: 2006-07-25
Pages: 6
Assignee
MEGIC CORPORATION
21 R&D FIRST ROAD, SCIENCE BASED INDUSTRIAL PARK, HSIN-CHU, TAIWAN
Covered Property
(1)
Structure of gold bumps and gold conductors on one IC die and methods of manufacturing the structures
Application:
60/586,840 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.