Patent Assignment
Reel/Frame 017574/0189
Assignment of Assignor's Interest
Recorded: 2006-05-04
Pages: 6
Assignor
MEGIC CORPORATION
Executed: 2006-04-28
Assignee
MEGICA CORPORATION
NO. 47, PARK 2ND RD., SCIENCE-BASED INDUSTRIAL PARK, ROOM 301/302, HSINCHU, TAIWAN
Covered Properties
(5)
High performance system-on-chip using post passivation process
Application:
09/637,926 →
High performance IC chip having discrete decoupling capacitors attached to its IC surface
Application:
60/455,154 →
Post-passivation metal scheme on an IC chip with copper interconnection
Application:
60/489,564 →
Structure of gold bumps and gold conductors on one IC die and methods of manufacturing the structures
Application:
60/586,840 →
Very thick metal interconnection scheme in IC chips
Application:
60/592,358 →
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 25, 2006
From: CHOU, CHIU-MING; LIN, MOU-SHIUNG
To: MEGIC CORPORATION
Reel/Frame 017991/0082 →
Assignment of Assignor's Interest
Jul 27, 2006
From: LIN, MOU-SHIUNG; CHOU, CHIU-MING; CHOU, CHIEN-KANG
To: MEGIC CORPORATION
Reel/Frame 018009/0813 →
Assignment of Assignor's Interest
Jul 27, 2006
From: LIN, MOU-SHIUNG; CHEN, YING-CHIH; CHOU, CHIEN-KANG; CHOU, CHIU-MING
To: MEGIC CORPORATION
Reel/Frame 018009/0835 →
Assignment of Assignor's Interest
Jul 27, 2006
From: LIN, MOU-SHIUNG
To: MEGIC CORPORATION
Reel/Frame 018011/0388 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →