IP Library › Patent Application 60489564
Patent Application Provisional Small
App. No. 60/489,564 · Confirmation No. 8529

Post-passivation metal scheme on an IC chip with copper interconnection

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2003-07-23 TRNA Transmittal of New Application 1 View
2003-07-23 SPEC Specification 2 View
2003-07-23 DRW Drawings-only black and white line drawings 5 View
2003-07-23 WFEE Fee Worksheet (SB06) 1 View
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Quick Facts
App. No.
60/489,564
Filed
2003-07-23