IP Library › Assignment 018009/0835
Patent Assignment
Reel/Frame 018009/0835

Assignment of Assignor's Interest

Recorded: 2006-07-27 Pages: 10
Assignors
LIN, MOU-SHIUNG
Executed: 2006-03-01
CHEN, YING-CHIH
Executed: 2006-03-01
CHOU, CHIEN-KANG
Executed: 2006-03-01
CHOU, CHIU-MING
Executed: 2006-03-01
Assignee
MEGIC CORPORATION
21 R&D FIRST ROAD, SCIENCE BASED INDUSTRIAL PARK, HSIN-CHU, TAIWAN
Covered Property (1)
Post-passivation metal scheme on an IC chip with copper interconnection
Application: 60/489,564 →
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 4, 2006
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 017574/0189 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →