Patent Application
Provisional
Small
App. No. 60/592,358
· Confirmation No. 1839
Very thick metal interconnection scheme in IC chips
Provisional Application Expired
Inventors
Attorneys & Agents of Record
Prosecution
- Customer No.
- 28112
- Docket No.
- MEG04007
- Confirmation No.
- 1839
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2014-07-11
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2006-07-27
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Quick Facts
- App. No.
- 60/592,358
- Filed
- 2004-07-29
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