IP Library Patent Application 60592358
Patent Application Provisional Small
App. No. 60/592,358 · Confirmation No. 1839

Very thick metal interconnection scheme in IC chips

Provisional Application Expired
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Code Description Pages PDF
2004-07-29 TRNA Transmittal of New Application 1 View
2004-07-29 SPEC Specification 4 View
2004-07-29 WFEE Fee Worksheet (SB06) 1 View
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Quick Facts
App. No.
60/592,358
Filed
2004-07-29