Patent Assignment
Reel/Frame 018009/0813
Assignment of Assignor's Interest
Recorded: 2006-07-27
Pages: 8
Assignors
LIN, MOU-SHIUNG
Executed: 2006-03-01
CHOU, CHIU-MING
Executed: 2006-03-01
CHOU, CHIEN-KANG
Executed: 2006-03-01
Assignee
MEGIC CORPORATION
21 R&D FIRST ROAD, SCIENCE BASED INDUSTRIAL PARK, HSIN-CHU, TAIWAN
Covered Property
(1)
Very thick metal interconnection scheme in IC chips
Application:
60/592,358 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.