Patent Assignment
Reel/Frame 018013/0406
Assignment of Assignor's Interest
Recorded: 2006-06-22
Pages: 3
Assignors
PARK, HONG-SICK
Executed: 2006-05-03
KIM, SHI-YUL
Executed: 2006-05-03
CHOUNG, JONG-HYUN
Executed: 2006-05-03
SHIN, WON-SUK
Executed: 2006-05-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Etchant, Method for Fabricating Interconnection Line Using the Etchant, and Method for Fabricating Thin Film Transistor Substrate Using the Etchant
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.