Patent Assignment
Reel/Frame 018031/0108
Assignment of Assignor's Interest
Recorded: 2006-06-24
Pages: 3
Assignors
LEE, JE-HUN
Executed: 2006-06-16
JEONG, CHANG-OH
Executed: 2006-06-16
CHO, BEOM-SEOK
Executed: 2006-06-16
BAE, YANG-HO
Executed: 2006-06-16
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Wire Structure, Method of Forming Wire, Thin Film Transistor Substrate, and Method of Manufacturing Thin Film Transistor Substrate
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.