Patent Assignment
Reel/Frame 018055/0299
Assignment of Assignor's Interest
Recorded: 2006-08-04
Pages: 6
Assignors
LEE, HI-KUK
Executed: 2006-07-26
LEE, DONG-KI
Executed: 2006-07-26
KIM, JAE-SUNG
Executed: 2006-07-26
KIM, BYUNG-UK
Executed: 2006-07-26
YOUN, HYOC-MIN
Executed: 2006-07-26
KOO, KI-HYUK
Executed: 2006-07-26
YUN, JOO-PYO
Executed: 2006-07-26
CHOI, SANG-GAK
Executed: 2006-07-26
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Photosensitive Resin Composition, Method of Manufacturing a Thin-Film Transistor Substrate, and Method of Manufacturing a Common Electrode Substrate Using the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.