Patent Assignment
Reel/Frame 018057/0251
Assignment of Assignor's Interest
Recorded: 2006-07-12
Pages: 2
Assignee
HYNIX SEMICONDUCTOR INC.
SAN 136-1, AMI-RI, BUBAL-EUB, ICHEON-SI, KYOUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Stack with Through-via Connection