Patent Assignment
Reel/Frame 018061/0373
Security Agreement
Recorded: 2006-08-07
Pages: 4
Assignor
ORMET CORPORATION
Executed: 2006-07-31
Assignee
BANK OF AMERICA, N.A.
55 SOUTH LAKE AVENUE, SUITE 900, PASADENA, CALIFORNIA, 91101
Covered Properties
(6)
Transient Liquid Phase Sintering Conductive Adhesives
Patent:
5,853,622 →
Application:
08/704,467 →
Vertically Interconnected Electronic Assemblies and Compositions Useful Therefor
Patent:
5,948,533 →
Application:
08/813,809 →
Metal-Plating of Cured and Sintered Transient Liquid Phase Sintering Pastes
Patent:
5,922,397 →
Application:
08/816,401 →
Novel Metal-Containing Compositions and Uses Thereof, Including Preparation of Resistor and Thermistor Elements
Patent:
5,980,785 →
Application:
08/942,368 →
Process for Producing High Performance Thermoelectric Modules
Patent:
6,127,619 →
Application:
09/093,966 →
Methods to Produce Insulated Conductive Through-Features in Conductive Core Materials for Electronic Packaging
Patent:
6,085,415 →
Application:
09/123,563 →
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 29, 2006
From: ORMET CORPORATION
To: ORMET CIRCUITS, INC.
Reel/Frame 017846/0927 →
Change of Name
Jun 30, 2006
From: TORANAGA TECHNOLOGIES, INC.
To: ORMET CORPORATION
Reel/Frame 017870/0883 →
Patent Promissory Note Supplement
Nov 11, 2006
From: ORMET CORPORATION
To: MATLINPATTERSON GLOBAL ADVISERS LLC
Reel/Frame 018505/0255 →
Release of Security Interest
Jan 31, 2007
From: MATLINPATTERSON GLOBAL ADVISERS LLC
To: ORMET CIRCUITS, INC.
Reel/Frame 018826/0631 →
Release and Reassignment of Memorandum of Security Interest in Intellectual Property
Apr 23, 2007
From: BANK OF AMERICAN, N.A., AS AGENT
To: ORMET CORPORATION
Reel/Frame 019193/0060 →
Assignment of Assignor's Interest
Aug 14, 2015
From: GANDHI, PRADEEP
To: ORMET CORPORATION
Reel/Frame 036330/0417 →