IP Library › Assignment 018826/0631
Patent Assignment
Reel/Frame 018826/0631

Release of Security Interest

Recorded: 2007-01-31 Pages: 6
Assignor
Assignee
ORMET CIRCUITS, INC.
43840 STATE ROUTE 7, HANNIBAL, OHIO, 43931
Covered Properties (6)
Transient Liquid Phase Sintering Conductive Adhesives
Patent: 5,853,622 →
Application: 08/704,467 →
Vertically Interconnected Electronic Assemblies and Compositions Useful Therefor
Patent: 5,948,533 →
Application: 08/813,809 →
Metal-Plating of Cured and Sintered Transient Liquid Phase Sintering Pastes
Patent: 5,922,397 →
Application: 08/816,401 →
Novel Metal-Containing Compositions and Uses Thereof, Including Preparation of Resistor and Thermistor Elements
Patent: 5,980,785 →
Application: 08/942,368 →
Process for Producing High Performance Thermoelectric Modules
Patent: 6,127,619 →
Application: 09/093,966 →
Methods to Produce Insulated Conductive Through-Features in Conductive Core Materials for Electronic Packaging
Patent: 6,085,415 →
Application: 09/123,563 →
Related Assignments (6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 29, 2006
From: ORMET CORPORATION
To: ORMET CIRCUITS, INC.
Reel/Frame 017846/0927 →
Change of Name Jun 30, 2006
From: TORANAGA TECHNOLOGIES, INC.
To: ORMET CORPORATION
Reel/Frame 017870/0883 →
Security Agreement Aug 7, 2006
From: ORMET CORPORATION
To: BANK OF AMERICA, N.A.
Reel/Frame 018061/0373 →
Patent Promissory Note Supplement Nov 11, 2006
From: ORMET CORPORATION
To: MATLINPATTERSON GLOBAL ADVISERS LLC
Reel/Frame 018505/0255 →
Release and Reassignment of Memorandum of Security Interest in Intellectual Property Apr 23, 2007
From: BANK OF AMERICAN, N.A., AS AGENT
To: ORMET CORPORATION
Reel/Frame 019193/0060 →
Assignment of Assignor's Interest Aug 14, 2015
From: GANDHI, PRADEEP
To: ORMET CORPORATION
Reel/Frame 036330/0417 →