Patent Assignment
Reel/Frame 018066/0353
Assignment of Assignor's Interest
Recorded: 2006-08-07
Pages: 3
Assignors
WU, EN-CHIEH
Executed: 2006-07-28
NG, HIEW WATT
Executed: 2006-07-28
CHEN, HUI-HUNG
Executed: 2006-07-28
TSAI, CHI-LONG
Executed: 2006-07-28
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD RD., NANTZE EXPORT PROCESSING ZONE, KAO-HSIUNG CITY, TAIWAN
Covered Property
(1)
Etchant and Method for Forming Bumps