Patent Assignment
Reel/Frame 018068/0377
Assignment of Assignor's Interest
Recorded: 2006-08-08
Pages: 5
Assignors
MAUNAND TUSSOT, CORINNE
Executed: 2006-07-03
MALEVILLE, CHRISTOPHE
Executed: 2006-06-23
MORICEAU, HUBERT
Executed: 2006-06-12
SOUBIE, ALAIN
Executed: 2006-06-09
Assignees
S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES S.A.
PARC TECHNOLOGIQUE DES FONTAINES, CHEMIN DES FRANQUES, BERNIN, 38190, FRANCE
COMMISSARIAT A L'ENERGIE ATOMIQUE (CEA)
31-33 RUE DE LA FEDERATION, PARIS, 75015, FRANCE
Covered Property
(1)
Methods for Preparing a Bonding Surface of a Semiconductor Wafer
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.