Patent Assignment
Reel/Frame 018089/0721
Assignment of Assignor's Interest
Recorded: 2006-07-25
Pages: 3
Assignor
SOEJIMA, KOJI
Executed: 2005-03-07
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Semiconductor Wafer, Semiconductor Chip and Method for Manufacturing the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.