Patent Assignment
Reel/Frame 018092/0625
Assignment of Assignor's Interest
Recorded: 2006-07-11
Pages: 2
Assignor
KATO, TOMIHISA
Executed: 2006-06-19
Assignee
ASAHI INTECC CO., LTD.
1703, WAKITA-CHO, MORIYAMA-KU, NAGOYA-SHI, AICHI-KEN, JAPAN
Covered Property
(1)
Heat Mold Device and a Method of Making a Guide Wire by Using the Same Heat Mold Device