IP Library › Assignment 018094/0807
Patent Assignment
Reel/Frame 018094/0807

Assignment of Assignor's Interest

Recorded: 2006-08-11 Pages: 4
Assignors
YAO, CHIH-HSIANG
Executed: 2006-06-22
HUANG, TAI-CHUN
Executed: 2006-06-22
LIANG, MONG-SONG
Executed: 2006-06-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN ROAD 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Integrated Circuit Having Improved Interconnect Structure
Patent: 7,772,701 →
Application: 11/422,769 →
Publication: US 2007/0284747
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 30, 2023
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
To: ADVANCED MANUFACTURING INNOVATIONS INC.
Reel/Frame 064180/0278 →