Assignment of Assignor's Interest

Recorded: 2006-08-15 Pages: 4

Assignors

WILSON, ROBIN

Executed: 2006-07-31

BROGAN, CONOR

Executed: 2006-07-25

MACNAMARA, CORMAC

Executed: 2006-07-25

GRIFFIN, HUGH J.

Executed: 2006-07-25

Assignee

ICEMOS TECHNOLOGY CORPORATION

P. O. BOX 24619, TEMPE, ARIZONA, 85285

Covered Property (1)

Method of Manufacturing a Photodiode Array with Through-Wafer Vias

Application: 60/821,993 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.