Patent Assignment
Reel/Frame 018111/0133
Assignment of Assignor's Interest
Recorded: 2006-07-17
Pages: 2
Assignors
CHEN, HSIEN-WEI
Executed: 2006-07-13
LIN, JIAN-HONG
Executed: 2006-07-13
LEE, TZU-LI
Executed: 2006-07-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, R.O.C. 300-77, TAIWAN
Covered Property
(1)
Process for Improving the Reliability of Interconnect Structures and Resulting Structure